In the first half of the year, the sales volume of China's integrated circuit packaging and testing industry broke new records|Industry News|News|Ningde Beres Electronics Co., Limited
In the first half of the year, the sales volume of China's integrated circuit packaging and testing industry broke new records
As an indispensable part of the integrated circuit industry chain, the integrated circuit packaging and testing industry is accompanied by the continuous development and change of integrated circuit chips. In recent years, its position in the entire integrated circuit industry chain has become increasingly prominent. Driven by the National Integrated Circuit Industry Development Promotion Outline and the National Integrated Circuit Industry Investment Fund, the integrated circuit packaging and testing industry has demonstrated unprecedented vitality at the level of capital mergers and acquisitions, and its growth rate is far higher than the global average. In particular, with the rapid launch of the national major science and technology project "Large scale integrated circuit manufacturing equipment and complete process", the technical capacity and process level of the packaging and testing industry have been continuously improved, the advanced packaging technology and process of medium and high-end products continue to be in line with international standards, and the product structure has been continuously optimized.